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Comment reply on FACUNDO's Completed Build: $100 Premium Ghetto Build W/ Carboard Case That Is Good For Cable Management

  • 41 months ago
  • 3 points

Nah, standard business practice. Like all of EVGA's PSUs being made by Super Flower and re-branded EVGA.

Like this case was made by an unspecified manufacturer in China then printed with the Epson logo.

Comment reply on FACUNDO's Completed Build: $100 Premium Ghetto Build W/ Carboard Case That Is Good For Cable Management

  • 41 months ago
  • 2 points

Epson got into the case business? I don't think so. They're re-branding another manufacturer's product with their logo. Check the bottom edge of the case, there should be a stamp somewhere telling you where it was really made.

Comment reply on FACUNDO's Completed Build: $100 Premium Ghetto Build W/ Carboard Case That Is Good For Cable Management

  • 41 months ago
  • 3 points

I was wondering about the quality of the case from a materials standard. Before I go with this case manufacturer, I need to know if they used a B or a C flute cardboard (A or A+C being the best and MOST Ultimate). This is important to me for reasons.

Comment reply on xCapa's Completed Build: MASpro 4K

  • 43 months ago
  • 1 point

I see. I would have sent that RAM back.

The image with the cable dividing the heat spreader on the RAM looks like white latches that are open, but on the newer images you can clearly see the latches are black.

Sorry about that.

Comment reply on xCapa's Completed Build: MASpro 4K

  • 43 months ago
  • 2 points

...then why are the latches not closed?

Comment reply on beaststeak's Completed Build: Tölva

  • 43 months ago
  • 1 point

That case looks a lot like the Case Labs S8. Still prefer the S8, but your case is one-sixth the price!

Comment reply on MasterEvilAce's Completed Build: EpicDuck - Modern i7 (Skylake) Build

  • 45 months ago
  • 2 points

Rads at the top are far more efficient. It blows the hot air outside of the case in the direction hot air normally travels, instead of blowing hot air from your components back into the case and onto your components.

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